solder ball size for game console reballing

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Re: solder ball size for game console reballing

Postby Flashing360 » Tue Jul 24, 2012 3:03 am

bretts going to do a direct heat video soon mate i believe :rolleyes:
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Re: solder ball size for game console reballing

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solder ball size for game console reballing

Postby Coleman » Tue Jul 24, 2012 3:35 am

What size solder is used for 360 ram? Pulled one off and turns out I have no stencil for ram so I used tweezers for first row and they all bridged with 0.6. Balls seem too big for the pads.
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Re: solder ball size for game console reballing

Postby DjAaron » Tue Jul 24, 2012 4:01 am

The ram chips use 0.45mm solder balls

I well add this to the list
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solder ball size for game console reballing

Postby Coleman » Tue Jul 24, 2012 4:03 am

Damn. Guess I gotta order some balls. Thanks bud
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Re: solder ball size for game console reballing

Postby sp4rkst4rt3r » Tue Jul 24, 2012 8:30 am

Coleman wrote:Damn. Guess I gotta order some balls. Thanks bud


Grow some Man :lol: :lol: :lol:
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solder ball size for game console reballing

Postby Coleman » Tue Jul 24, 2012 12:22 pm

lol figured you'd chime in. Is there a stencil for the ram?
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Re: solder ball size for game console reballing

Postby Flashing360 » Tue Jul 24, 2012 12:33 pm

i believe so mate, ill have a look through the sets i got here and see what i can find. i know for a fact theres direct stencils so yes there will be ram ;)
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Re: solder ball size for game console reballing

Postby gordo » Mon Apr 21, 2014 7:54 pm

Yes there is a stencil for xbox ram. Another advantage, in my opinion, for using the next size smaller ball on direct heat stencils is there is almost no danger of pulling a pad when pulling the stencil off. Those direct heat are easier because you don't have to worry as much about the balls moving around but they can be tough to pull off especially if you managed to get a little flux on them. When you pull the stencil it can pull a pad very easily and you may not realize it until it's too late. I have all direct heat and I can say there are pluses and minuses for both kinds. If your board is true and flat and same with the chip I will go down to the next size. If the board has been worked on before by someone with a heat gun and I can see any bow at all then I would use the size it calls for. This is of coarse just my opinion but I've thought about this a lot and it makes sense for me. Also, I got a good tip from a video I watched and I think it was a member here that made the video but anyway after cleaning the stencil they throw them in the ultrasonic cleaner which I plan on doing that to see if it helps. Not sure what they used as a liquid but I've used distilled water and alcohol before on Iphone logic boards that were water damaged and it seems to help get the crud from the places you can't get too. FWIW
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Re: solder ball size for game console reballing

Postby Hoang » Mon Feb 20, 2017 11:11 am

Game console motherboard repair becomes a big market.BGA reballing station is in large demand.
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